Abstract
Using molecular-dynamics simulation, we study the scattering and penetration of normally incident hyperthermal (5–400 eV) Ne, Ar, and Xe atoms off a Cu crystal. We find that between 80% and 98% of the incident energy is deposited in the solid; the fraction depends primarily on the projectile mass, and — for not too low energies — only slightly on the bombarding energy. At low energy, the major part of the non-deposited energy is carried away by the reflected projectile. At energies above the sputter threshold, an increasingly important contribution of between 2% and 6% of the incident energy is carried away by sputtered particles. These results compare well with experiment. Electronic inelastic losses show only little influence on this behaviour. We demonstrate that the inclusion of a realistic attractive interaction between the projectile and the target atoms influences the energy deposition considerably at energies below around 100 eV.
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