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Thermal shock resistance of silicon nitride ceramics

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Strength of Materials Aims and scope

Conclusions

  1. 1.

    In reaction-bound silicon nitride specimens quenched in water after having been heated to 400–480°C, thermal shock causes weakening by a factor of six to seven. With lower heating temperature weakening is not encountered. The test results of specimens without weakening and with considerable weakening overlap in the range of furnace temperatures 400–480°C.

  2. 2.

    Calculations of the state of stress of a rod by the finite element method showed that the first cracks may appear 0.1 sec after the specimens were submerged in water.

  3. 3.

    The coefficient of variation of specimens that are substantially weakened after being cooled from 400–500°C increases by 35–50%. When the specimens are heated to 700–900°C, the coefficient of variation is equal to the initial value because of a large number of thermal cracks. This was also confirmed by an analysis of the fractures of specimens.

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Authors
  1. K. A. Kazakyavichyus
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  2. D. V. Narbutene
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  3. E. N. Chasovskoi
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  4. A. F. Batura
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  5. V. G. Verevka
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Additional information

Kaunas. Obninsk. Translated from Problemy Prochnosti, No. 11, pp. 57–60, November, 1988.

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Kazakyavichyus, K.A., Narbutene, D.V., Chasovskoi, E.N. et al. Thermal shock resistance of silicon nitride ceramics. Strength Mater 20, 1477–1480 (1988). https://doi.org/10.1007/BF01530150

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  • DOI: https://doi.org/10.1007/BF01530150

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