Abstract
Results are presented from a numerical modeling of the solution of a problem involving optimization of the thermal regime in the assembly of integrated circuits. The modeling was performed on array processors of hybrid computers.
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Abbreviations
- Tg :
-
gas temperature
- α:
-
heat-transfer coefficient
- cV :
-
specific heat capacity
- λ:
-
thermal conductivity
- τ:
-
time
- q:
-
heat flux
- L:
-
internal heat of phase transformations or other internal transformations
- cVe :
-
effective volumetric heat capacity
- ρ:
-
density
- qV :
-
power of internal heat sources
- g:
-
gas
- c:
-
convection, contact
- sp:
-
spectral
- r:
-
radiative
- L:
-
phase transformation
- V:
-
volumetric
- 0:
-
initial
- e:
-
environment
- ℓ:
-
liquidus
- s:
-
solidus
- s:
-
surface
- σ:
-
total
- R-R:
-
resistance circuit
- Λ:
-
Liebmann method
- T:
-
Gel'perin method
Literature cited
L. A. Kozdoba, Electrical Modeling of Heat and Mass Transfer Phenomena [in Russian], Moscow (1972).
N. I. Gel'perin, G. I. Lapshenkov, A. L. Taran, and A. V. Taran, Teor, Osn. Khim. Tekhnol.,9, No. 3, 380–386 (1975).
L. A. Kozdoba and V. K. Mel'nik, Heat and Mass Transfer-VI. Materials of the 6th All-Union Conference on Heat and Mass Transfer, Vol. 9, Minsk (1980), pp. 96–99.
L. A. Kozdoba and V. I. Makhnenko, Inzh.-Fiz. Zh.,4, No. 4, 102–104 (1961).
L. A. Kozdoba and P. G. Kurkovskii, Methods of Solving Inverse Heat Conduction Problems [in Russian], Kiev (1982).
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Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 56, No. 5, pp. 793–798, May, 1989.
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Burenko, V.I., Kozdoba, L.A. Numerical modeling of thermal regimes during the assembly of a multicomponent system. Journal of Engineering Physics 56, 564–568 (1989). https://doi.org/10.1007/BF01297607
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DOI: https://doi.org/10.1007/BF01297607