Abstract
Depth profiles of Ga2O3/a-SiO2/Al2O3- substrate, Ga2O3/a-Si3N4/Al2O3- substrate, and Ga2O3/Al2O3 substrate thin layers were determined by the SNMS/HFM method. Al diffusion from the Al2O3 substrate was investigated after 50, and in some cases after 600 hours of heat treatment time at different temperatures (600 °C,850 °C,950 °C,1050 °C and 1150 °C). The diffusion coefficient of Al at 850 °C was found to be D Al=8.7 * 10−18 cm2/s in amorphous SiO2; D Al=1.5*10−17 cm2/s in amorphous Si3N4 and D Al=5.5* 10−16 cm2/s in Ga2O3 at 600 °C, respectively. The possible diffusion mechanism is explained in terms of the metal-oxygen bond-strengths. Although the studied materials have high resistivity at room temperature, the applied SNMS/HFM method has proven to be an efficient surface analytical tool even in these cases.
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Dedicated to Professor Dr. rer. nat. Dr. h.c. Hubertus Nickel on the occasion of his 65th birthday
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Paulus, H., Kornely, S., Giber, J. et al. Investigation of Al diffusion in different oxide thin-film layers by SNMS/HFM method. Mikrochim Acta 125, 223–227 (1997). https://doi.org/10.1007/BF01246187
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DOI: https://doi.org/10.1007/BF01246187