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An analysis of the creep of hot pressed silicon nitride in bending

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Abstract

The creep behaviour of hot pressed silicon nitride is investigated in four-point-bend tests at temperatures of about 1200° C. By use of appropriate creep laws for the primary creep range as well as for the secondary range the experimental results can be well described analytically.

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Authors and Affiliations

  1. Kernforschungszentrum Karlsruhe, Institut für Material- und Festkörperforschung IV, Germany

    T. Fett & D. Munz

  2. Institut für Keramik im Maschinenbau, Universität Karlsruhe, Germany

    K. Keller

  3. Institut für Zuverlässigkeit und Schadenskunde im Maschinenbau, Universität Karlsruhe, 7500, Karlsruhe, Germany

    D. Munz

Authors
  1. T. Fett
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  2. K. Keller
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  3. D. Munz
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Fett, T., Keller, K. & Munz, D. An analysis of the creep of hot pressed silicon nitride in bending. J Mater Sci 23, 467–474 (1988). https://doi.org/10.1007/BF01174671

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  • DOI: https://doi.org/10.1007/BF01174671

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