Abstract
The two types of reactions that occur between 60/40 tin-lead solder and platinum were explored: (1) solid-state diffusion, in which the intermetallic compound PtSn4 was observed to form; and (2) dissolution. Both bulk and thin-film couples were used and the extent of reaction in each was revealed by optical and scanning electron microscopy methods. Solid-state compound growth followed parabolic kinetics with an effective activation energy of 23 kcal mol−1 (96.2 kJ mol−1). Diffusion of platinum through PtSn4 appears to limit compound growth. Dissolution of platinum wires in solder resulted in a linear decrease in wire diameter with time. The process occurred with an activation energy of 20.4 kcal mol−1 (85.4 kJ mol−1) and was attributed to Pt-Pt bond breaking assisted by strong chemical interaction with tin.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
D. Olsen, R. Wright andH. Berg, in “13th Annual Proceedings of the Reliability Physics Symposium” (IEEE 1975) p. 80.
D. R. Frear, W. B. Jones andK. R. Kinsman (eds), “Solder Mechanics — A State-of-the-Art Assessment” TMSEMPMD Monograph Series, Vol. 1 (TMS, Warrendale, PA, 1991).
“Diffusion and Defect Data” (Trans. Tech, Bay Village, OH, (1967–1981).
H. Berg andE. L. Hall, in “11th Annual Proceedings of the Reliability Physics Symposium” (IEEE, 1973) p. 10.
W. G. Bader,Weld. J. 48 (1969) 551-s.
W. G. Bader, in “Symposium on Precious Metals in the Electronics Industry”, (American Electroplaters' Society, Winter Park, FL, 1980).
L. Zakraysek, in “11th Annual Proceedings of the Reliability Physics Symposium” (IEEE, 1973) p. 6.
S. K. Kang andV. Ramachandran,Scripta Metall. 14 (1980) 421.
K.-N. Tu andR. Rosenberg, in “Proceedings of the 6th International Vacuum Congress” (1974) p. 633.
B. W. Meagher, Master's thesis, Stevens Institute of Technology (1991).
E. W. Brothers,Western Electr. Eng. (Spring 1981) p. 49.
I. Y. Khandros andM. Ohring,J. Mater. Sci. 24 (1989) 252.
E. A. Brandes (ed.), “Smithells Metals Reference Book”, 6th Edn (Butterworths, Boston, 1983) pp. 13-9–12-22.
W. K. Warburton andD. Turnbull, in “Diffusion in Solids — Recent Developments”, edited by A. S. Nowick and J. J. Burton, (Academic Press, New York, 1975) pp. 180–3.
C. Herzig, in “DIMETA-82 Diffusion in Metals and Alloys”, edited by F. J. Kedves and D. L. Beke (Trans. Tech. Switzerland, 1983) p. 24.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Meagher, B., Schwarcz, D. & Ohring, M. Compound growth in platinum/tin-lead solder diffusion couples. J Mater Sci 31, 5479–5486 (1996). https://doi.org/10.1007/BF01159320
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF01159320