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Covalently bonded organosilicon and organoaluminium dispersants for silicon carbide

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Abstract

Covalently bonded organosilicon and organoaluminium compounds were used as dispersants for SiC powder and whiskers in hexane. The improved dispersion resulted in a threefold increase in whisker packing density in sedimented compacts. Comparison experiments with organosilanes having the formulas RSi (OCH3)3 and RSiCl3 showed that the chlorosilanes were much more effective than their alkoxy counterparts in dispersing SiC powder. The aluminium alkoxy carboxylate aluminiumsec-butoxide stearate was also a much more effective dispersant for SiC than the alkoxysilanes. Fourier transform infrared spectroscopy and solid-state13C nuclear magnetic resonance were used to characterize the organometallic dispersants grafted to the surface of the SiC.

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Authors and Affiliations

  1. Ceramics Processing Research Laboratory, Materials Processing Center, Massachusetts Institute of Technology, 02139, Cambridge, Massachusetts, USA

    J. R. Fox, M. J. Ungureit & H. K. Bowen

Authors
  1. J. R. Fox
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  2. M. J. Ungureit
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  3. H. K. Bowen
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Fox, J.R., Ungureit, M.J. & Bowen, H.K. Covalently bonded organosilicon and organoaluminium dispersants for silicon carbide. J Mater Sci 22, 4532–4535 (1987). https://doi.org/10.1007/BF01132058

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  • DOI: https://doi.org/10.1007/BF01132058

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