Journal of Applied Electrochemistry

, Volume 12, Issue 1, pp 53–58 | Cite as

Diffusional kinetics of metalliding zinc into solid copper

  • A. Sclafani
  • V. Augugliaro
  • L. Rizzuti
  • S. Lucia


The process of incorporation of zinc into a copper cathode has been experimentally studied in a molten salt system at 381±2° C and at various current densities. The process is shown to be kinetically controlled by the diffusion of Zn into the solid matrix. A galvanostatic pulse titration technique has been used to determine the chemical diffusion coefficient at various alloy compositions, and an exponential relationship has been found between the diffusivity and the third power of the zinc concentration in the alloy. This relationship was then used in the diffusion equation within the solid matrix and a numerical integration was performed. Very good agreement was found between the calculated and experimental data for Zn interfacial concentration versus time. The same calculation procedure was used to determine zinc concentration profiles in the alloys.


Zinc Concentration Profile Diffusion Equation Alloy Composition Zinc Concentration 
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concentration of the diffusing metal (mol cm−3)


chemical diffusion coefficient of A into B (cm2 s−1)


cell e.m.f. (mV)


Faraday number


current density (A cm−2)


time (s)


alloy molar volume (cm3 mol−1)


linear dimension in the diffusion direction (cm)


zinc mass fraction in the alloy


ionic valence of Zn


stoichiometric ratio Zn/Cu


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  1. [1]
    N. C. Cook,Sci. Amer. 221 (1969) 38.PubMedGoogle Scholar
  2. [2]
    B. N. Kabanov, I. G. Kiseleva and I. I. Astakhov,Soviet Electrochem. 8 (1972) 927.Google Scholar
  3. [3]
    C. A. Melendres,J. Electrochem. Soc. 124 (1977) 650.Google Scholar
  4. [4]
    W. Weppner and R. A. Huggins,ibid 124 (1977) 1569.Google Scholar
  5. [5]
    B. N. Kabanov, I. I. Astakhov and I. G. Kiseleva,Electrochim. Acta 24 (1979) 167.Google Scholar
  6. [6]
    S. Atlung, K. West and T. Jacobsen,J. Electrochem. Soc. 126 (1979) 1311.Google Scholar
  7. [7]
    Y. Y. Andreev,Soviet Electrochem. 15 (1979) 39.Google Scholar
  8. [8]
    D. Inman and S. H. White,J. Appl. Electrochem. 8 (1978) 375.Google Scholar
  9. [9]
    R. S. Sethi,ibid 9 (1979) 411.Google Scholar
  10. [10]
    A. Sclafani, D. Curto, G. Polizzotti and V. Augugliaro,Metallurgia Italiana 72 (1980) 539.Google Scholar
  11. [11]
    C. S. Tedmon and W. C. Hagel,J. Electrochem. Soc. 115 (1968) 151.Google Scholar
  12. [12]
    R. F. Brebrick, in ‘Solid State Chemistry and Physics’, Vol. 2, (edited by P. F. Weller) Marcel Dekker, New York (1974).Google Scholar
  13. [13]
    C. J. Wen, B. A. Boukamp, R. A. Huggins and W. Weppner,J. Electrochem. Soc. 126 (1979) 2258.Google Scholar
  14. [14]
    B. Carnaham, H. A. Luther and J. Wilckes, ‘Applied Numerical Methods’, John Wiley, New York (1969).Google Scholar

Copyright information

© Chapman and Hall Ltd. 1982

Authors and Affiliations

  • A. Sclafani
    • 1
  • V. Augugliaro
    • 1
  • L. Rizzuti
    • 1
  • S. Lucia
    • 1
  1. 1.Istituto di Ingegneria ChimicaUniversity of PalermoItaly

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