Conclusions
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1.
Molten solder causes a reduction in the mechanical properties of alloy KhN67MVTYu as a result of embrittling it and occurrence in it of local stress concentrations.
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2.
In order to reduce the probability of crack development in the alloy and failure of structures during soldering it is necessary to limit its contact with molten solder by barrier coatings or using solder with a melting temperature close to that of the single-phase state of the metal; in this way the reduction in strength will be insignificant.
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Literature Cited
V. N. Semenov, A. I. Chernitsyn, V. V. Sagalovich, et al., „Effect of soldering thermal cycle on the structure of alloy ÉP202 and its tendency toward cracking under the action of molten solder”, Svarochnoe Proizvodstvo, No. 1, 36–37 (1976).
„Methods of phase analysis for nickel alloys”, in: Physicochemical Methods of Phase Analysis for Steels and Alloys, N. F. Lashko (ed.) [in Russian], Metallurgiya, Moscow (1970).
E. V. Panchenko, Yu. A. Skakov, B. I. Kriner, et al., Metallography Laboratory [in Russian], Metallurgiya, Moscow (1965).
Additional information
Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 6, pp. 42–44, June, 1990.
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Semenov, V.N. Effect of molten solder on the formation of stress concentrations in alloy KhN67MVTYu during soldering. Met Sci Heat Treat 32, 447–449 (1990). https://doi.org/10.1007/BF01100166
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DOI: https://doi.org/10.1007/BF01100166