Abstract
The oxidation behavior of a cast TiAl intermetallic compound and its sputtered microcrystalline film was investigated at 700–900°C in static air. At 700°C, both the cast alloy and its sputtered microcrystalline film exhibited excellent oxidation resistance. No scale spallation was observed. However, at 800–900°C, the oxidation kinetics for the cast TiAl alloy followed approximately a linear rate law, which indicates that it has poor oxidation resistance over this temperature range. The poor oxidation resistance of TiAl was due to the formation of an Al2O3+TiO2 scale which spalled extensively during cooling. Nevertheless, the sputtered, TiAl-microcrystalline film exhibited very good oxidation resistance. The oxidation kinetics followed approximately the parabolic rate law at all temperatures. Although the composition of the scales was the same as that of scales formed on the cast alloy, the scales formed on the sputtered microcrystalline-TiAl film are adherent strongly to the substrate. No scale spallation was found at 700–850°C, while a small amount of spallation was observed only at 900°C. This indicates that microcrystallization can improve the oxidation resistance of the TiAl alloy.
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References
Y. M. Kim,J. Met. 42, 24 (1989).
T. Kawabata, T. Kanai, and O. Izumi,Acta. Metall. 33, 1355 (1985).
T. Grobstein and J. Doychak, (Eds.),Oxidation of High-Temperature Intermetallics (The Minerals, Metals and Materials Society, Warrendale, 1988).
S. Becker, A. Rahmel, M. Schorr, and M. Schutze,Oxid. Met. 38, 425 (1992).
R. A. Perkins, K. T. Chiang, and G. H. Meier,Script. Metall. 21, 1505 (1987).
K. Hirukawa, H. Mabuchi, and Y. Nakayama,Script. Metall. 25, 1211 (1991).
J. L. Smialek, M. A. Gedwill, and P. K. Brindley,Script. Metall. 24, 1291 (1990).
S. Taniguchi, T. Shibada, and K. Takechi,Mater. Trans. JIM 32, 299 (1991).
A. Rahmel and P. J. Spencer,Oxid. Met. 35, 53 (1991).
J. Subrahmanyam,J. Mater. Sci. 23, 1906 (1988).
S. C. Kung and R. A. Rapp,J. Electrochem. Soc. 135, 731 (1988).
K. Kawabata, K. Hashimoto, H. Doi and T. Tsujimoto,J. Jn. Inst. Met. 53, 58 (1989).
S. C. Kung,Oxid. Met. 24, 217 (1990).
F. Wang, H. Lou, and W. Wu,Acta Metall. Sinica. 27, B382 (1991). (in Chinese).
F. Wang, H. Lou,Mater. Sci. Engng. A129, 279 (1990).
F. Wang, H. Lou, W. Wu,Vacuum 43, 749 (1992).
H. Lou, F. Wang, B. Xia, and L. Zhang,Chin. J. Met. Sci. Technol. 8, 347 (1992).
H. Lou, F. Wang, B. Xia, and L. Zhang,Oxid. Met. 38, 299 (1992).
H. Lou, F. Wang, B. Xia, and L. Zhang,Corros. Sci. Prot. Tech. 5, 101 (1993).
F. D. Richardson and J. H. E. Jeffes,J. Iron Steel Inst. 160, 261 (1948).
G. H. Meier and F. S. Pettit, inHigh Temperature Intermetallics (The Royal Society, London, 1991), p. 66.
K. L. Luthra,Oxid. Met. 36, 475 (1991).
F. Wang, H. Lou, and W. Wu,Acta Metall. Sinica 29, B115 (1993).
C. Wagner,Z. Electrochem. 63, 772 (1959).
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Wang, F., Lou, H. & Wu, W. The oxidation resistance of a sputtered, microcrystalline TiAl-intermetallic-compound film. Oxid Met 43, 395–409 (1995). https://doi.org/10.1007/BF01046890
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DOI: https://doi.org/10.1007/BF01046890