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Electrochemical evaluation of copper deposition with gas sparging

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Abstract

The influence of gas sparging during copper electrolysis was studied using standard electrochemical techniques. The polarization behaviour of acid copper electrolytes was determined in the presence and absence of gas sparging on vertical electrodes. Tracer ion techniques were employed to determine the effect of gas sparging and forced circulation of the electrolyte on the mass transfer characteristics of the system. In addition to the potentiodynamic scans, 3-h copper deposits were produced for morphology and orientation studies. The effect of current density and temperature on deposition were also studied. The polarization experiments have shown that a mass transfer component becomes evident at about 40% of the limiting current density at which point the deposit becomes noticeably rougher.

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References

  1. W. Harvey and L. Hsueh,CIM Bull. 69 (1976) 109.

    Google Scholar 

  2. W. Cooper,J. Appl. Electrochem. 15 (1985) 789.

    Google Scholar 

  3. W. Cooper and K. Mishra,Hydrometallurgy 17 (1987) 305.

    Google Scholar 

  4. W. W. Harvey, M. R. Randlett and K. I. Bangerskis,J. Metals 30 (1978) 32.

    Google Scholar 

  5. V. A. Ettel, A. S. Gendron and B. V. Tilak, 102nd AIME (1973).

  6. Idem, J. Electrochem. Soc. 121 (1974) 867.

    Google Scholar 

  7. T. J. O'Keefe, S. F. Chen, J. S. Cuzmar and V. A. Ettel, ‘Hydrometallurgical Reactor Design,’ (edited by R. G. Bautista, R. J. Wesely and G. W. Warren) TMS, Warrendale, PA (1987) p. 359.

    Google Scholar 

  8. C. R. Wilke, M. Eisenberg and C. W. Tobias,J. Electrochem. Soc. 49 (1953) 513.

    Google Scholar 

  9. E. J. Fenech and C. W. Tobias,Electrochim. Acta 2 (1960) 311.

    Google Scholar 

  10. D. J. Pickett and K. L. Ong,ibid. 19 (1974) 875.

    Google Scholar 

  11. H. Y. Sohn and M. E. Wadsworth, ‘Rate Processes of Extractive Metallurgy’, Plenum, New York (1976) p. 141.

    Google Scholar 

  12. D. J. Robinson, PhD Dissertation, Univ. Sheffield (1970)

  13. J. M. West, ‘Electrodeposition and Corrosion Process’, 2nd Edn, Van Nostrand Reinhold, New York (1970) p. 125.

    Google Scholar 

  14. P. Padilla, F. A. Olson and T. N. Andersen, ‘Energy Reduction Techniques in Metal Electrochemical Processes”, (edited by R. G. Bautista and R. J. Wesely) TMS-AIME, New York (1985) p. 179.

    Google Scholar 

  15. E. Mattson and J. O'M. Bockris,Trans. Farday Soc. 54 (1958) 1586.

    Google Scholar 

  16. I. R. Burrows, J. A. Harrison and J. Thompson,Electroanal. Chem. Interfacial Electrochem. 58 (1975) 241.

    Google Scholar 

  17. J. R. White,J. Appl. Electrochem. 15, (1987) 977.

    Google Scholar 

Download references

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Authors and Affiliations

  1. Department of Metallurgical Engineering and Materials Research Center, University of Missouri-Rolla, 65401, Rolla, MO, USA

    D. A. Uceda & T. J. O'keefe

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  1. D. A. Uceda
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  2. T. J. O'keefe
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Uceda, D.A., O'keefe, T.J. Electrochemical evaluation of copper deposition with gas sparging. J Appl Electrochem 20, 327–334 (1990). https://doi.org/10.1007/BF01033612

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  • DOI: https://doi.org/10.1007/BF01033612

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