Journal of Applied Electrochemistry

, Volume 20, Issue 2, pp 231–234 | Cite as

XPS and AES studies of the composition of the viscous liquid film in the electropolishing of copper

  • Jing Li Fang
  • Nai Jun Wu


Phosphorus was detected with XPS and AES on the electropolished copper obtained in different hydroxyethylidene-diphosphonic acid (HEDP) concentrations, at different pH values and in various solutions (H3PO4, HEDP, and HEDP+H3PO4). The results show that no phosphorus appears on the copper surface, so that the viscous liquid film formed can be easily removed by washing. The viscous liquid film obtained from H3PO4+HEDP solution possesses very good film-forming characteristics. The composition of the viscous film can be established from the constant composition region of the depth profile curve and may be considered to be a polynuclear coordination polymeric compound with a structural unit of approximately [Cu4(PO)4) (HEDP)] n .


Copper Phosphorus H3PO4 Structural Unit Depth Profile 
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  1. [1]
    D. R. Gabe,Metallography 5 (1972) 415.Google Scholar
  2. [2]
    A. Hickling and J. K. Higgins,Trans. Inst. Metal Finish 29 (1953) 10.Google Scholar
  3. [3]
    ‘Metal Finishing Guidebook and Directory Issue’,84(1A) (1986) 397.Google Scholar
  4. [4]
    ‘Metal surface Technique Handbook of Japan’, Tokyo (1976) p. 135.Google Scholar
  5. [5]
    Jing Li Fang,Petrol. Chem. Eng. China (7) (1980) 422.Google Scholar
  6. [6]
    Jing Li Fang and Yue Hua Yu,Chem. J. of Chinese Univ. 2(3) (1981) 285.Google Scholar
  7. [7]
    Jing Li Fang, ‘Multiple-complex Electroplating’, National Defence Industry Press, (1983) Beijing, p. 273–290.Google Scholar
  8. [8]
    P. A. Jacquet,Met. Rev. 1 (1956) 157.Google Scholar
  9. [9]
    M. I. Ismail, F. N. Zein and M. G. Fouad,Bull. Fac. Eng. Univ. Alexandria (ser): Chem. Eng. 14 (1975) 101.Google Scholar
  10. [10]
    T. P. Hoar, D. C. Mears and G. P. Rothwell,Corrosion Sci. 5 (1965) 279.Google Scholar
  11. [11]
    H. F. Walton,J. Electrochem. Soc. 97 (1950) 219.Google Scholar
  12. [12]
    D. Laforgue-Kantzner,C.R. Acad. Sci. 233 (1951) 547.Google Scholar
  13. [13]
    K. P. Batashev and E. N. Nikitin,J. appl. Chem. (Russ.) (3) (1950) 23.Google Scholar
  14. [14]
    Jing Li Fang,Acta Chinica Sinica 41(6) (1983) 505.Google Scholar
  15. [15]
    Jing Li Fang and Cai Zi,Plating Surface Finishing (2) (1988) 58;Science in China, Ser. B 32(1) (1989) 23.Google Scholar
  16. [16]
    P. T. Andrews and P. Weightman,J. Electron Spect. Rel. Phen. 21 (1980) 175.Google Scholar
  17. [17]
    C. D. Wagner, W. M. Riggs, L. E. Davis, J. F. Moulder and G. E. Muilenberg, ‘Handbook of X-ray Photoelectron Spectroscopy’, Perkin-Elmer Co. (1979).Google Scholar
  18. [18]
    S. W. Gaarenstroom and N. Winograd,J. chem. Phys. 67 (1977) 3500.Google Scholar
  19. [19]
    N. S. Mcintyre, T. E. Rummery, M. G. Cook and O. Owen,J. Electrochem. Soc. 123 (1976) 1165.Google Scholar
  20. [20]
    A. G. Akimov, O. L. Rozenfel'd and M. G. Astaf'ev,Elektrokhimya 12 (1976) 570.Google Scholar

Copyright information

© Chapman and Hall Ltd. 1990

Authors and Affiliations

  • Jing Li Fang
    • 1
  • Nai Jun Wu
    • 1
  1. 1.Applied Chemistry InstituteNanjing UniversityNanjingChina

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