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Journal of Applied Electrochemistry

, Volume 17, Issue 2, pp 315–321 | Cite as

On the electroplating of laminated chromium

  • E. S. Chen
  • G. P. Capsimalis
  • G. R. Weigle
Papers

Abstract

A microprocessor-controlled flow plating process was developed to deposit laminated chromium consisting of alternating layers of low contraction (LC) and high contraction (HC) chromium. The automated plating system contains a large number of variable parameters designed to allow the use of multiple plating modes. The available modes include a combination of direct current, interrupted, periodic reverse, pulse and laminated chromium plating.

The laminated plating experiments were conducted at LC/HC solution temperatures of 85 and 55°C, current densities of 120 and 45 A dm−2, and at LC/HC duty cycles to produce spacings between 0.01 and 2.7 μm. Under these plating conditions, deposits with hardness values between 655 and 1089 KHN (Knoop hardness number, kg mm−2) and tensile strengths between 6.8 and 57.2 were obtained.

Keywords

Physical Chemistry Chromium Tensile Strength Variable Parameter Duty Cycle 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall Ltd. 1987

Authors and Affiliations

  • E. S. Chen
    • 1
  • G. P. Capsimalis
    • 1
  • G. R. Weigle
    • 1
  1. 1.Development and Engineering Command, Close Combat Armaments Center, Benet Weapons LaboratoryUS Army Armament ResearchWatervlietUSA

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