Journal of Electronic Testing

, Volume 5, Issue 2–3, pp 219–228 | Cite as

Trade-off analysis on cost and manufacturing technology of an electronic product: Case study

  • Shekar Rao
  • Bert Haskell
  • Ian Yee
Article
  • 93 Downloads

Abstract

A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.

Keywords

Benchmarking redesign trade-off analysis of PCB (printed circuit boards) 

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References

  1. 1.
    C. Capillo,Surface Mount Technology, McGraw-Hill Publishing Company, 1990.Google Scholar

Copyright information

© Kluwer Academic Publishers 1994

Authors and Affiliations

  • Shekar Rao
    • 1
  • Bert Haskell
    • 1
  • Ian Yee
    • 1
  1. 1.Microelectronics and Computer Technology Corp.Austin

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