ASP modules: cost-effective building-blocks for real-time DSP systems

  • R. M. Lea


ASP (Associative String Processor) architecture and support software provide the base technology for the development of versatile, replaceable, and highly compact building-blocks for the simple construction of modular real-time DSP systems, offering step-function improvements in cost-performance, application flexibility, reliability, and ease of maintenance. Based on a fully programmable and fault-tolerant homogeneous computational architecture, emerging from research at Brunel University and being developed by Aspex Microsystems, ASP modules offer cost-effective support of a particularly wide range of DSP applications, by mapping application data structures to a common string representation supporting content-addressing, parallel processing and a reconfigurable inter-processor communication network. Moreover, by exploiting state-of-the-art microelectronics and packaging technologies, the ASP modules achieve processor packing-densities which are more ussually associated with memory components. Indeed, the ASP has been designed to benefit from the inevitable VLSI-to-ULSI-to-WSI technological trend, with a fully integrated simply scalable, and defect/fault-tolerant processor interconnection strategy. The architecture, software, and implementation of ASP modules are discussed, and the paper indicates that the potential of a peak performance of 1 TOPS (i.e., 1E12 operations (e.g., 12-bit adds) per second) with an input-output bandwidth of 3,200 Mbytes/second could be achieved with only 10 ASP modules, within less than a cubic-foot, dissipating 1 KW, and for less than $1M.


Digital Signal Processing Systolic Array Digital Signal Processing System Digital Signal Processing Application Data Communication Network 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Kluwer Academic Publishers 1989

Authors and Affiliations

  • R. M. Lea
    • 1
  1. 1.Aspex Microsystems Ltd., Electrical Engineering and ElectronicsBrunel UniversityUxbridgeUK

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