Abstract
An edge crack in a strip of functionally gradient ceramics (FGC) is studied under thermal loading conditions. Two FGC materials are considered, i.e., one with a spatial variation of shear modulus and the other with a spatial variation of thermal conductivity. Thermal stress intensity factors (TSIF) are numerically calculated based on singular integral equations derived for the dislocation density along the crack faces. It is shown that: (a) for the FGC with a graded shear modulus, the TSIF are reduced for crack lengths longer thanl c b and remain approximately the same as those of a homogeneous material for shorter crack lengths, wherel c is about 0.065 andb is the width of the strip; and (b) for the FGC with a thermal conductivity gradient, the TSIF are generally lower compared with those for the bonded two-layer material.
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Jin, Z.H., Mai, Y.W. Thermal fracture of functionally gradient ceramics. Z. angew. Math. Phys. 47, 467–484 (1996). https://doi.org/10.1007/BF00916650
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DOI: https://doi.org/10.1007/BF00916650