Abstract
Ion-implanted high ohmic resistors may exhibit a low temperature coefficient, if the annealing after implantation is not complete. This effect is explained by deep energy levels. Experimental results are presented for B+- and Al+-implanted resistors.
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References
K. Rosendal: Rad. Effects7, 95 (1975)
H. Runge, E.F. Krimmel: Solid State Electr.18, 149 (1975)
H. Runge: Phys. Stat. sol. (a)30, 147 (1975)
H. Runge: Appl. Phys.8, 43 (1975)
H. Runge: InIon Implantation in Semiconductors, ed. by S. Namba, (Plenum Press, New York: 1975)
R.A. Smith:Semiconductors (Cambridge at the University Press 1959)
I.W. Mayer, L. Eriksson, I.A. Davies: InIon Implantation in Semiconductors (Academic Press New York: 1970)
M. Schulz: Appl. Phys.4, 91 (1974)
S.M. Sze:Physics of Semiconductor Devices (J. Wiley and Sons, New York 1969)
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Runge, H., Krimmel, E.F. The influence of deep levels on the temperature coefficient of ion-implanted resistive layers in silicon. Appl. Phys. 10, 181–185 (1976). https://doi.org/10.1007/BF00896337
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DOI: https://doi.org/10.1007/BF00896337