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Interaction of a quasistatic crack with a ternary boundary junction

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Abstract

In a study of the interaction of a crack with a tricrystal, the stress required for the crack to break through the junction of the crystal is found by photoelastic and optical-microscopy methods. Several possible mechanisms for this breakthrough are offered. The stresses around a ternary junction are calculated, and the interactions of these stresses with a dislocation crack is studied.

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Authors and Affiliations

  1. Tambov Institute of Chemical Machine Construction, USSR

    V. M. Finkel', A. M. Podkauro, V. P. Ivanov & Yu. I. Tyalin

Authors
  1. V. M. Finkel'
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  2. A. M. Podkauro
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  3. V. P. Ivanov
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  4. Yu. I. Tyalin
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Additional information

Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizikii, No. 1, pp. 50–55, January, 1975.

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Finkel', V.M., Podkauro, A.M., Ivanov, V.P. et al. Interaction of a quasistatic crack with a ternary boundary junction. Soviet Physics Journal 18, 41–45 (1975). https://doi.org/10.1007/BF00889806

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  • DOI: https://doi.org/10.1007/BF00889806

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