Abstract
A method of combined investigation is proposed for thermal and electrical process in semiconductor modules with a temperature constraint.
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Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 48, No. 3, pp. 483–489, March, 1985.
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Aga, O.B., Dul'nev, G.N., Pol'shchikov, B.V. et al. Modeling thermal and electrical processes in a semiconductor module with a temperature constraint. Journal of Engineering Physics 48, 366–371 (1985). https://doi.org/10.1007/BF00878207
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DOI: https://doi.org/10.1007/BF00878207