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Relationship of structural changes in the surface of copper during anodic solution to the semiconductor properties of the film that arises

  • Physical Chemistry
  • Published:
Bulletin of the Academy of Sciences of the USSR, Division of chemical science Aims and scope

Conclusions

  1. 1.

    The structural changes in the surface of copper during anodic solution in a 3% solution of copper sulfate with an addition of 1% sulfuric acid were studied. The dissolution at current densities lying above the abrupt increase in the potential leads to smoothing of the microroughness of the surface without luster.

  2. 2.

    Electron-diffraction studies have established that in this case a thin film of cuprous oxide arises on the copper surface.

  3. 3.

    According to the data of photoelectrochemical investigations, it has been hypothesized that the smoothing of the surface is due to the high-resistance contact layer of cuprous oxide at the interface with copper.

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Authors and Affiliations

  1. A. E. Arbuzov Chemical Institute, Academy of Sciences, USSR

    T. N. Grechukhina & A. Sh. Valeev

Authors
  1. T. N. Grechukhina
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  2. A. Sh. Valeev
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Additional information

The article is published on the basis of a resolution of the Conference of Editors-in-Chief of the Journals of the Academy of Sciences USSR, of July 12, 1962 as the dissertation workof T. N. Grechukhina.

The authors would like to thank O. S Vozdvizhenskii for his discussion of the work and his advice.

Translated from Izvestiya Akademii Nauk SSSR, Seriya Khimicheskaya, No. 11, pp. 1942–1945, November 1965

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Grechukhina, T.N., Valeev, A.S. Relationship of structural changes in the surface of copper during anodic solution to the semiconductor properties of the film that arises. Russ Chem Bull 14, 1910–1913 (1965). https://doi.org/10.1007/BF00845880

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  • DOI: https://doi.org/10.1007/BF00845880

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