Summary
Using the cluster model of the silicon (111) surface we derive by means of EHT calculations a mechanism of reactive plasma etching in the system F/Si including diffusion processes. Species SiF2 are found to be the primary etching products at the surface. SiF4 is formed with high probability in the gas phase.
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Fricke D. K., Müller H. (1981) Wiss. Z. Friedrich-Schiller-Univ. Jena, Math.-Naturwiss. Reihe30: 429; Fricke D. K., Müller H. (1982) Wiss. Z. Friedrich-Schiller-Univ. Jena, Math.-Naturwiss. Reihe31: 895
Fricke D. K., Müller H., Opitz Ch. (1983) Chem. Phys. Lett.94: 421
Chuang T. J. (1980) J. Appl. Phys.51: 2614
Donelly V. M., Flamm D. L. (1980) J. Appl. Phys.51: 5273
Mitchel M. J., Suto M., Lee L. C., Chuang T. J. (1987) J. Vac. Sci. Technol.B5: 1444
Suto M., Han J. C., Lee L. C., Chuang T. J. (1989) J. Chem. Phys.90: 2834
Seel M., Bagus P. S. (1983) Phys. Rev.B28: 2023
Müller H., Optiz Ch. (1985) Wiss. Z. Friedrich-Schiller-Univ. Jena, Math.-Naturwiss. Reihe34: 661
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Opitz, C., Müller, H. & Kodlaa, A. Quantenchemische Untersuchung der Elementarprozesse beim Plasmaätzen im System Fluor/Silizium. Monatsh Chem 121, 331–338 (1990). https://doi.org/10.1007/BF00809447
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DOI: https://doi.org/10.1007/BF00809447