Conclusions
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1.
A study was made of the effects of process parameters in the deposition of copper on SmCo5 powder particles by the contact method upon the yield of copper into the coating.
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2.
It was established that the copper content of the powder is strongly affected by the pH of the working cupric chloride solution and its concentration; the temperature and prior pickling of SmCo5 powder have no significant effect upon the degree of copper plating of the powder.
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3.
A study was made of the specific surface of metal-plated SmCo5 powder as a function of its copper content. It was established that the optimum copper content is 4–10%, enabling even and continuous copper deposits to be obtained on the surfaces of powder particles.
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Translated from Poroshkovaya Metallurgiya, No. 1(157), pp. 1–4, January, 1976.
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Aleksandrov, E.M., Shishkin, R.S., Kulikova, K.F. et al. Copper plating of SmCo5 powder. Powder Metall Met Ceram 15, 1–4 (1976). https://doi.org/10.1007/BF00792397
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DOI: https://doi.org/10.1007/BF00792397