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Reactive deposition: a fundamental breakthrough in powder metallurgy

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Journal of Materials Science Letters

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References

  1. A. C. C. TSEUNG, S. P. JIANG, Y. Z. CHEN and J. K. YOU, British Provisional Patent Application No. 88.154 943, (29 June 1988).

  2. B. MacDOUGALL,J. Electrochem. Soc. 126 (1979) 919.

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Author notes

  1. Y. -Z. Chen & J. -K. You

    Present address: Department of Chemistry, Xiamen University, Xiamen, China

Authors and Affiliations

  1. Chemical Energy Research Centre, University of Essex, Wivenhoe Park, CO4 3SQ, Colchester, Essex, UK

    A. C. C. Tseung, S. -P. Jiang, Y. -Z. Chen & J. -K. You

Authors
  1. A. C. C. Tseung
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  2. S. -P. Jiang
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  3. Y. -Z. Chen
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  4. J. -K. You
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Tseung, A.C.C., Jiang, S.P., Chen, Y.Z. et al. Reactive deposition: a fundamental breakthrough in powder metallurgy. J Mater Sci Lett 9, 1294–1295 (1990). https://doi.org/10.1007/BF00726524

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  • DOI: https://doi.org/10.1007/BF00726524

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