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Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Materials Application Department, Toshiba Research and Development Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa-ken, Japan

    Michihiko Inaba, Koichi Teshima, Osamu Hirao & Toshiharu Sakurai

  2. Semiconductor Industrial Engineering Department, Semiconductor Division, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa-ken, Japan

    Toshiharu Sakurai

Authors
  1. Michihiko Inaba
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  2. Koichi Teshima
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  3. Osamu Hirao
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  4. Toshiharu Sakurai
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Inaba, M., Teshima, K., Hirao, O. et al. Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface. J Mater Sci Lett 3, 400–402 (1984). https://doi.org/10.1007/BF00724377

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  • DOI: https://doi.org/10.1007/BF00724377

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