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An empirical correlation for the grain-boundary diffusion of impurities in copper

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Metallurgy, University of Sheffield, S1 3JD, Sheffield, UK

    R. S. Mishra, H. Jones & G. W. Greenwood

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  1. R. S. Mishra
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  2. H. Jones
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  3. G. W. Greenwood
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Mishra, R.S., Jones, H. & Greenwood, G.W. An empirical correlation for the grain-boundary diffusion of impurities in copper. J Mater Sci Lett 7, 728–730 (1988). https://doi.org/10.1007/BF00722081

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  • DOI: https://doi.org/10.1007/BF00722081

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