Conclusions
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1.
The diffusion of nitrogen in tantalum in the nitriding process at 600–1000°C occurs with the formation of nitride phases and the subsequent growth of their layers. The hexagonal nitrides TaN and Ta2N form on the surface of the nitrided metal, and a zone of the solid solution of nitrogen in tantalum forms at greater depths.
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2.
The temperature dependence of the thickness of the diffusion zone located beneath the nitride layer is altered at nitriding temperatures above 850°C (the hardness decreases); this is explained by the formation of various modifications of the outer nitride; tantalum should therefore be nitrided at temperatures no higher than 850°C to obtain the required diffusion zone.
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Additional information
Moscow N. E. Bauman Advanced Technical School. Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 5, pp. 32–35, May, 1984.
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Prokoshkin, D.A., Voronova, T.A., Gorbova, A.S. et al. Nitriding of tantalum. Met Sci Heat Treat 26, 357–360 (1984). https://doi.org/10.1007/BF00707409
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DOI: https://doi.org/10.1007/BF00707409