Conclusions
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1.
Crack generation and growth in alloy ÉP202 with interaction of molten copper-silver solder occurs as a result of development in it of local volume of limiting tensile stress concentrators and alloy embrittlement.
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2.
Spontaneous alloy failure is caused by microcracks which generate within its volume at the instant preceding growth of a main crack.
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Literature cited
V. N. Semenov, A. I. Chernitsyn, and V. V. Sagalovich, "Effect of alloy ÉP202 structure on tendency towards cracking during soldering", Svaroch. Proizvod., No. 1 (1976).
V. N. Semenov and V. V. Sagalovich, "Effect of heat treatment on the mechanical properties of alloy ÉP202", Metalloved. Term. Obrab. Met., No. 9, 54–56 (1976).
V. N. Semenov, "Effect of molten solder on formation of stress concentrations in alloy KhN67MVTYu during soldering", Metalloved. Term. Obrab. Met., No. 6, 42–44 (1990).
Additional information
Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 4, pp. 20–22, April, 1992.
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Semenov, V.N. Crack generation and development in alloy ÉP202 during soldering of a bimetallic structure. Met Sci Heat Treat 34, 255–257 (1992). https://doi.org/10.1007/BF00702545
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DOI: https://doi.org/10.1007/BF00702545