Abstract
The initial stages of gold electrodeposition on a gold electrode were studied in a proprietary bath (Renovel N) using linear sweep voltammetry and chronoamperometry. Tafel plots with two different slopes were obtained, indicating that the mechanism for gold deposition depends on potential. An inhibition phenomenon was observed during gold electrocrystallization. Experimental current-time transients were analysed using nonlinear least-squares approximations by various models of nucleation and crystal growth. The electrodeposition mechanism changes from three-dimensional progressive at lower overpotentials to three-dimensional instantaneous at higher overpotentials. Moreover, additional two-dimensional progressive or a secondary three-dimensional progressive processes take place in certain potential ranges. It was shown that the outward growth rate of the substrate's base plane displays a linear Tafel relationship whereas the vertical growth rate of gold crystals decreases at more negative potentials due to an inhibition process.
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References
I. R. Christie and B. P. Cameron,Gold Bull. 27 (1994) 12.
F. R. Schlodder, H. H. Beyer and W. G. Zilske, ‘GOLD 100’: Proceedings of the International Conference on Gold, Johannesburg (1986), vol. 3, p. 21.
H. Y. Cheh,J. Electrochem. Soc. 118 (1971) 551.
H. G. Silver,ibid. 116 (1969) 26C.
H. Angerer and N. Ibl,J. Appl. Electrochem. 9 (1979) 219.
C. Buelens, J. P. Celis and J. R. Roos,ibid. 13 (1983) 541.
J. A. Harrison and J. Thompson,J. Electroanal. Chem. 40 (1972) 113.
I. R. Burrows, J. A. Harrison and J. Thompson,ibid. 53 (1974) 283.
H. Y. Cheh and R. Sard,J. Electrochem. Soc. 118 (1971) 1737.
J. D. E. McIntyre and W. F. Peck, Jr.,ibid. 123 (1976) 1800.
D. M. MacArthur,ibid. 119 (1972) 672.
E. T. Eisenmann,ibid. 125 (1978) 717.
M. Beltowska-Brzezinska, E. Dutkiewicz and W. Lawicki,J. Electroanal. Chem. 99 (1979) 341.
P. Bindra, D. Light, P. Freudenthal and D. Smith,J. Electrochem. Soc. 136 (1989) 3616.
G. A. Kurnoskin, V. N. Flerov, A. N. Moskvichev and A. O. Rózhdestvenskii,Elektrokhimiya 22 (1987) 1124.
A. Survila, V. Mockevicius and R. Višomirskis,ibid. 23 (1987) 816.
J. Horkans and L. T. Romankiw,J. Electrochem. Soc. 124 (1977) 1499.
J. W. M. Jacobs and J. M. G. Rikken,ibid. 136 (1989) 3633.
V. J. Scocha, E. Raub and A. Knödler,Metalloberflaeche-Angew, Electrochem. 27 (1973) 1.
B. Vincent, P. Bercot, G. F. Creusat, G. Messin and J. Pagetti,Plat. Surf. Finish. 77 (1990) 71.
J. A. Harrison and J. Thompson,J. Electroanal. Chem. 59 (1975) 273.
D. Davidović and R. R. Adzić,Electrochim. Acta 33 (1988) 103.
E. Matulionis and A. Dziuve,Chemija 178 (1990) 44.
S. T. Rao and R. Weil,J. Electrochem. Soc. 127 (1980) 1030.
S. T. Rao and R. Weil,Trans. Inst. Met. Finish. 57 (1979) 97.
K. Lin, R. Weil and K. Desai,J. Electrochem. Soc. 133 (1986) 690.
K. L. Lin, W. C. Liu, M. H. M. Lin and Y. W. Liu,ibid. 138 (1991) 3276.
G. Holmbom and B. E. Jacobson,ibid. 135 (1988) 2720.
C. Bocking and C. Cameron,Trans. I. M. F. 72 (1994) 33.
C. Bocking and C. Dineen,ibid. 72 (1994) 101.
W. Chrzanowski, Y. G. Li and A. Lasia,J. App. Electrochem., in press.
Y. G. Li and A. Lasia,J. Appl. Electrochem. 26 (1996) 853–863.
M. Fleischmann and H. R. Thirsk,in ‘Advances in Electrochemistry and Electrochemical Engineering’, Vol. 3 (edited by P. Delahay and C. Tobias) Wiley Interscience, New York (1963), p. 123.
J. A. Harrison and H. R. Thirsk,in ‘Electroanalytical Chemistry’, Vol. 5 (edited by A. J. Bard) Marcel Dekker, London (1971), p. 67.
I. R. Burrows, J. A. Harrison and J. Thompson,J. Electroanal. Chem. 58 (1975) 241.
J. A. Harrison, H. B. Sierra Alcazar and J. Thompson,ibid. 53 (1974) 145.
A. Hernandez Creus, P. Carro, S. González, R. C. Salvarezza and A. J. Arvia,Electrochim Acta 37 (1992) 2215.
M. Y. Abyaneh and M. Fleischmann,J. Electroanal. Chem. 119 (1981) 187, 197.
M. Y. Abyaneh, J. Hendrikx, W. Visscher and E. Barendrecht,J. Electrochem. Soc. 129 (1982) 2654.
V. G. Roev and N. V. Gudin,Elektrokhimiya 31 (1995) 532.
A. J. Bard and L. R. Faulkner, ‘Electrochemical Methods (Fundamentals and Applications)’, John Wiley & Sons, New York (1980), p. 304.
Y. G. Li and A. Lasia, under preparation.
D. S. Gnanamuthu and J. V. Petrocelli,J. Electrochem. Soc. 114 (1967) 1036.
S. Nakahara and Y. Okinaka,ibid. 128 (1981) 284.
G. Holmbom and B. E. Jacobson,ibid. 135 (1988) 787.
Y. Okinaka and S. Nakahara,ibid. 123 (1976) 1284.
Y. Okinaka, Proceedings of the Symposium on Electrodeposition Technology, Theory and Practice, Electrochemical Society, Pennington NJ (1987), p. 147.
G. B. Munier,Plating 56 (1967) 1151.
H. Baltruschat and J. Heitbaum,J. Electroanal. Chem. 157 (1983) 319.
D. H. Son and K. Kim,Bull. Korean Chem. Soc. 15 (1994) 357.
E. B. Budevski,in ‘Comprehensive Treatise of Electrochemistry’, Vol. 7 (edited by B. E. Conway, J. O'M. Bockis, E. Yeager, S. U. M. Khan and R. E. White), Plenum Press, London (1983), p. 399 and references therein.
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Li, Y.G., Chrzanowski, W. & Lasia, A. Nucleation and crystal growth in gold electrodeposition from acid solution Part I: Soft gold. J Appl Electrochem 26, 843–852 (1996). https://doi.org/10.1007/BF00683747
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DOI: https://doi.org/10.1007/BF00683747