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Temperature dependence of the energy of Cu [110] symmetrical tilt grain boundaries

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Mechanical and Control Engineering, The University of Electro-Communications, 182, Chofu, Tokyo, Japan

    H. Miura

  2. Department of Materials Science and Engineering, Tokyo Institute of Technology, 4289 Nagatsuta, 227, Midori-ku, Yokohama, Japan

    M. Kato & T. Mori

Authors
  1. H. Miura
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  2. M. Kato
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  3. T. Mori
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Miura, H., Kato, M. & Mori, T. Temperature dependence of the energy of Cu [110] symmetrical tilt grain boundaries. J Mater Sci Lett 13, 46–48 (1994). https://doi.org/10.1007/BF00680270

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  • DOI: https://doi.org/10.1007/BF00680270

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