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Metal Science and Heat Treatment

, Volume 12, Issue 6, pp 509–511 | Cite as

Heat treatment of soldered copper joints

  • Yu. F. Shein
  • I. E. Petrunin
Technical Information
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Conclusions

  1. 1.

    The mechanical properties of copper joints soldered with lead and PSr 7.5 solder at 850°C in vacuum remain unchanged with increasing cooling rates.

     
  2. 2.

    When copper joints are soldered with tin and indium in vacuum an increase of the cooling rate reduces the hardness in the zone of fusion and increases the shear strength of the joint. The strength and ductility are highest at a cooling rate of 100 deg/sec.

     
  3. 3.

    The formation of phases in cooling of soldered joints is similar to the formation of phases during solidification of alloys in large volumes. Changing the cooling rate can affect the crystallization process in the zone of fusion and the structure and properties of the joint.

     

Keywords

Copper Indium Mechanical Property Crystallization Heat Treatment 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Literature cited

  1. 1.
    N. N. Prokhorov, Physical Processes in Metals during Welding [in Russian], Metallurgiya, Moscow (1968).Google Scholar
  2. 2.
    W. Tiller and G. Rutter, Canadian J. Phys.,34, No. 1 (1956).Google Scholar

Copyright information

© Consultants Bureau, a division of Plenum Publishing Corporation 1970

Authors and Affiliations

  • Yu. F. Shein
  • I. E. Petrunin

There are no affiliations available

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