Interaction of tungsten with copper, manganese, silver, and tin
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Tungsten can be soldered with copper, manganese, silver, and tin to produce joints of high strength. Under the influence of the molten solders the finest defect-free crystals of tungsten are dispersed. When the seam is saturated with them and they solidify in the capillary gap under conditions excluding interaction with the surrounding atmosphere the joint is strong.
At soldering temperatures tungsten is intensively dissolved in molten copper, manganese, silver, and tin. Solution is due to adsorption reduction of the strength of tungsten under the influence of the molten solders.
The absence of interactions in the tungsten-copper, tungsten-manganese, tungsten-silver, and tungsten-tin systems needs further investigation.
In soldering tungsten with copper a presumably independent phase is formed. It forms a layer in the seam at the boundary between tungsten and the fusion zone or separate inclusions on prolonged holding at soldering temperature.
KeywordsCopper Atmosphere Manganese Tungsten Fusion Zone
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