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Low-temperature heat capacity of helium films adsorbed on copper

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Abstract

Heat capacity measurements are described for films of pure4 He and a 12%He 3 mixture ofHe 3 andHe 4He adsorbed on copper, for 0.1<T<1.2 K.He 4 heat capacity isotherms show a step-type behavior as a function of coverage for the first two layers, while the mixture isotherms only show the first step. A comparison is made with recent multilayer data for helium films on Vycor published by other authors.

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Work supported by the National Science Foundation.

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Hickernell, D.C., McLean, E.O. & Vilches, O.E. Low-temperature heat capacity of helium films adsorbed on copper. J Low Temp Phys 13, 241–248 (1973). https://doi.org/10.1007/BF00654064

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