Abstract
The ablation of ceramic Bi-Ca-Sr-Cu-O by XeCl-excimer-laser projection has been investigated. In both air and vacuum, etching commences at about 2.4 J/cm2 and then increases with fluence within the regime investigated (Φ <) 20 J/cm2). At 10 J/cm2 the respective etch rates are around 1 μm/pulse and 1.6 μm/pulse.
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References
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