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The effect of certain ions on the internal stress of bright copper electrodeposits

Abstract

The effect of low concentrations (0–100 mg 1−1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1−1 of thiourea as a brightening additive was used as the electrolyte: CuSO4·5H2O (225 g l−1), H2SO4 (60g l−1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte.

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Gana, R.E., Figueroa, M.G. & Larraín, R.J. The effect of certain ions on the internal stress of bright copper electrodeposits. J Appl Electrochem 9, 465–469 (1979). https://doi.org/10.1007/BF00617557

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  • DOI: https://doi.org/10.1007/BF00617557

Keywords

  • Copper
  • Physical Chemistry
  • 5H2O
  • H2SO4
  • Thiourea