Journal of Applied Electrochemistry

, Volume 13, Issue 4, pp 429–438 | Cite as

Nodulation of electrodeposited copper due to suspended particulate

  • T. N. Andersen
  • C. H. Pitt
  • L. S. Livingston
Papers

Abstract

Cathode nodulation was studied by electrodepositing copper at 38 mA cm−2 from acid sulphate baths which contained 0.5 g dm−3 of various suspended particulate. The conductive particulates, such as copper and graphite, produced dense nodulation at temperatures of 50° C and less. Antimony and silver powders caused pitting as well as nodulation. Non-conducting powders such as lead sulphate, lead dioxide, and gypsum produced no nodulation, and correspondingly were occluded only to a very small extent. Once formed, the nodules occluded very large concentrations of any particulate present. The nodulation decreased markedly with an increase in temperature, particularly from 50° to 70° C. With increasing Cu2+ ion concentration, the nodulation decreased nominally. These effects and characteristics of the nodulated deposits are discussed.

Keywords

Copper Nodule Dioxide Graphite Acid Sulphate 

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Copyright information

© Chapman and Hall Ltd 1983

Authors and Affiliations

  • T. N. Andersen
    • 1
  • C. H. Pitt
    • 2
  • L. S. Livingston
    • 2
  1. 1.Kennecott, Process TechnologySalt Lake City
  2. 2.Department of Metallurgy and Metallurgical EngineeringUniversity of UtahSalt Lake City

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