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The effect of glue, LIX65N and chloride ion on the morphology of electrowon copper

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Abstract

The combined effects of dissolved and entrained organic extractant, LIX65N, and the addition agents, glue and chloride ion on the morphology of electrowon copper were systematically investigated. The deposit morphology was assessed by optical microscopy techniques, scanning electron microscopy (SEM) and X-ray diffraction (XRD) measurements. The results indicated that the quality of copper deposits obtained in the presence of glue and LIX65N is considerably improved by the addition of chloride ion in concentration higher than 40 ppm.

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References

  1. D. R. Turner and G. R. Johnston,J. Electrochem. Soc. 109 (1962) 798.

    Google Scholar 

  2. F. Ogburn and M. A. Morris,Plating 49 (1962) 72.

    Google Scholar 

  3. L. L. Shreir and J. W. Smith,Trans. Faraday Soc. 50 (1954) 393.

    Google Scholar 

  4. L. I. Gurevich and A. I. Pomorov,Elektrokhimiya 7 (1971) 158.

    Google Scholar 

  5. J. O'M. Bockris and M. Enyo,Trans. Faraday Soc. 58 (1962) 158.

    Google Scholar 

  6. V. I. Lakshmanan, D. J. MacKinnon and J. M. Brannen,J. Appl. Electrochem. 7 (1977) 81.

    Google Scholar 

  7. Idem, Trans. Inst. Mining Metall. Sect. C 85 (1976) 183.

    Google Scholar 

  8. D. J. MacKinnon and V. I. Lakshmanan, ‘Recent Advances in Copper Electrowinning’, CANMET Scientific Bulletin, CM76-10.

  9. V. A. Ettel, B. V. Tilak and A. S. Gendron,J. Electrochem. Soc. 121 (1974) 867.

    Google Scholar 

  10. T. Balberyszski and A. K. Andersen,Proc. Aust. Inst. Min. Met. 244 (1972) 11.

    Google Scholar 

  11. W. W. Harvey, M. R. Randlett and K. I. Bangerskis,Trans. Inst. Mining Metall. Sect. C 84 (1975) 210.

    Google Scholar 

  12. A. Damjanovic,Plating 52 (1965) 1017.

    Google Scholar 

  13. N. Dhananjayan, G. Eichkorn and H. R. Mache,Electrochim. Acta 15 (1970) 617.

    Google Scholar 

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Author notes

  1. V. I. Lakshmanan

    Present address: Extraction Metallurgy Department, Noranda Research Centre, Pointe Claire, H9R 1G5, Quebec

Authors and Affiliations

  1. Department of Energy, Mines and Resources, Metallurgical Chemistry Section, Mineral Sciences Laboratories, Canada Centre for Mineral and Energy Technology, Ottawa, Canada

    D. J. Mackinnon, V. I. Lakshmanan & J. M. Brannen

Authors
  1. D. J. Mackinnon
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  2. V. I. Lakshmanan
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  3. J. M. Brannen
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Mackinnon, D.J., Lakshmanan, V.I. & Brannen, J.M. The effect of glue, LIX65N and chloride ion on the morphology of electrowon copper. J Appl Electrochem 8, 223–234 (1978). https://doi.org/10.1007/BF00616425

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  • DOI: https://doi.org/10.1007/BF00616425

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