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Tensile properties and morphology of pyrophosphate copper deposits

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Abstract

New data which precisely define the effects of various operating parameters on the tensile properties of electrodeposits from the dimercaptothiadiazole/copper pyrophosphate system are presented. Two additive concentration ranges yielding high ductility and high tensile strength are delineated. Characteristic deposit microstructures are identified and correlated with the tensile properties. The results are interpreted in terms of the mechanism by which the additive functions, and implications for circuit board plating are discussed.

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Authors and Affiliations

  1. Rockwell International Microelectronics Research and Development Center, 91360, Thousand Oaks, CA, USA

    C. Ogden, D. Tench & J. White

Authors
  1. C. Ogden
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  2. D. Tench
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  3. J. White
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Ogden, C., Tench, D. & White, J. Tensile properties and morphology of pyrophosphate copper deposits. J Appl Electrochem 12, 619–626 (1982). https://doi.org/10.1007/BF00614991

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  • DOI: https://doi.org/10.1007/BF00614991

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