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Journal of Applied Electrochemistry

, Volume 11, Issue 3, pp 395–400 | Cite as

On the mechanism of electroless plating. II. One mechanism for different reductants

  • J. E. A. M. Van Den Meerakker
Papers

Abstract

A mechanism is proposed for the reactions in electroless plating solutions with different reducing agents. The mechanism is based on the formation of atomic hydrogen during the oxidation of the reducing agents. The hydrogen atoms can either be oxidized or be desorbed as a gas. The mechanism accounts for both the electrochemical and the catalytic nature of the process.

Keywords

Oxidation Hydrogen Physical Chemistry Atomic Hydrogen Electroless Plating 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. [1]
    M. Paunovic,Plating 55 (1968) 1161.Google Scholar
  2. [2]
    A. V. Gorodyskii, I. A. Stepanova and A. I. Zayats,Sov. Electrochem. 9 (1973) 312.Google Scholar
  3. [3]
    I. Ohno,Surf. Technol. 4 (1976) 515.Google Scholar
  4. [4]
    H. Zeilmaker and E. Barendrecht,Proc. 9th World Congress on Metal Finishing, Amsterdam (October 1976).Google Scholar
  5. [5]
    Y. Okinaka,J. Electrochem. Soc. 120 (1973) 739.Google Scholar
  6. [6]
    A. E. Cahill,Proc. Amer. Electroplating Soc. 44 (1957) 130.Google Scholar
  7. [7]
    S. M. El-Raghy and A. A. Abo-Salama,J. Electrochem. Soc. 126 (1979) 171.Google Scholar
  8. [8]
    C. H. de Minjer,Electrodeposition and Surf. Treatment 3 (1975) 261.Google Scholar
  9. [9]
    W. Machu and S. El-Gendi,Metalloberfläche 13 (1959) 97.Google Scholar
  10. [10]
    J. Elze,Metallogr. 14 (1960) 104.Google Scholar
  11. [11]
    K. Müller,Metalloberfläche 14 (1960) 65.Google Scholar
  12. [12]
    P. L. Cavallotti and G. Salvago,Electrochim. Metallogr. 3 (1968) 239.Google Scholar
  13. [13]
    G. Salvago and P. L. Cavallotti,Plating 59 (1972) 665.Google Scholar
  14. [14]
    Z. Kovac and I. M. Croll,Electrochem. Soc. Meeting, Montreal, October (1968) Abstract No. 488.Google Scholar
  15. [15]
    P. Hersch,Trans. Inst. Metal Finishing 33 (1955–6) 417.Google Scholar
  16. [16]
    R. M. Lukes,Plating 51 (1964) 969.Google Scholar
  17. [17]
    Idem, ibid 51 (1964) 1066.Google Scholar
  18. [18]
    A. Brenner and G. E. Riddell,J. Res. Nat. Bur. Standards 37 (1946) 1.Google Scholar
  19. [19]
    G. Gutzeit,Plating 46 (1959) 1158.Google Scholar
  20. [20]
    D. J. Levy,Proc. Amer. Electroplating Soc. 50 (1963) 29.Google Scholar
  21. [21]
    T. V. Ivanovskaya and K. M. Gorbunova,Prot. Metals 2 (1966) 393.Google Scholar
  22. [22]
    A. A. Nikiforova and G. A. Sadakov,Sov. Electrochem. 3 (1967) 1076.Google Scholar
  23. [23]
    F. M. Donahue,Oberfläche 13 (1972) 301.Google Scholar
  24. [24]
    K. M. Gorbunova, M. V. Ivanov and V. P. Moiseev,J. Electrochem. Soc. 120 (1973) 613.Google Scholar
  25. [25]
    K. A. Holbrook and P. J. Twist,J. Chem. Soc. A (1971) 890.Google Scholar
  26. [26]
    W. Franke and J. Mönch,Liebigs Ann. Chem. 550 (1941) 1.Google Scholar
  27. [27]
    A. A. Sutyagina, K. M. Gorbunova and M. P. Glazunov,Russian J. Phys. Chem. 37 (1963) 1096 and 1196.Google Scholar
  28. [28]
    K. A. Holbrook and P. J. Twist,J. Chem. Soc.,Dalton (1972) 1865.Google Scholar
  29. [29]
    H. Hoyer,Z. Naturforsch. 4(a) (1949) 335.Google Scholar
  30. [30]
    F. Pearlstein and R. F. Weightman,Electrochem. Technol 6 (1968) 427.Google Scholar
  31. [31]
    A. Luneckas and I. Genutiene,Liet. TSR, Moslu Akad. Darb., Ser. B 4 (1975) 13.Google Scholar
  32. [32]
    G. Gutzeit,Plating 47 (1960) 63.Google Scholar
  33. [33]
    K. M. Gorbunova, M. V. Ivanov and A. A. Nikiforova,Prot. Metals 6 (1970) 470.Google Scholar
  34. [34]
    F. Pearlstein and R. F. Weightman,Plating 61 (1974) 154.Google Scholar
  35. [35]
    E. B. Saubestre,ibid 59 (1972) 563.Google Scholar
  36. [36]
    J. P. Randin and H. E. Hintermann,ibid 54 (1967) 523.Google Scholar
  37. [37]
    D. J. Levy,Electrochem. Technol. 1 (1963) 38.Google Scholar
  38. [38]
    J.W. Dini and P. R. Coronado,Plating 54 (1967) 385.Google Scholar
  39. [39]
    A. Molenaar, M. F. E. Holdrinet and L. K. H. van Beek,ibid 61 (1974) 238.Google Scholar
  40. [40]
    J. Dumesic, J. A. Koutsky and T. W. Chapman,J. Electrochem. Soc. 121 (1974) 1405.Google Scholar
  41. [41]
    Y. Okinaka,Plating 57 (1970) 914.Google Scholar
  42. [42]
    S. Yu. Vereshchinskii,Tr. Moskow Energy Inst. 112 (1972) 93.Google Scholar
  43. [43]
    N. V. Korovin and B. N. Yanchuk,Sov. Electrochem. 5 (1969) 1087.Google Scholar
  44. [44]
    N. V. Korovin and B. N. Yanchuk,ibid 7 (1971) 354.Google Scholar
  45. [45]
    S. Trasatti and A. Alberti,J. Electroanal. Chem. 12 (1966) 236.Google Scholar
  46. [46]
    J. Heitbaum and W. Vielstich,Electrochim Acta 18 (1973) 501.Google Scholar
  47. [47]
    R. P. Buck and L. R. Griffith,J. Electrochem. Soc. 109 (1962) 1005.Google Scholar
  48. [48]
    J. P. Elder and A. Hickling,Trans. Faraday Soc. 58 (1962) 1852.Google Scholar
  49. [49]
    J. P. Eider,Electrochim. Acta 7 (1962) 417.Google Scholar
  50. [50]
    K. M. Gorbunova and A. A. Nikiforova,Prot. Metals 5 (1969) 163.Google Scholar
  51. [51]
    M. Lelental,J. Electrochem. Soc. 120 (1973) 1650.Google Scholar
  52. [52]
    V. S. Daniel'-Bek and T. N. Glazamova,Sov. Electrochem. 2 (1966) 1279.Google Scholar
  53. [53]
    T. H. James,J. Phys. Chem. 66 (1962) 2416.Google Scholar
  54. [54]
    M. Lelental,J. Catalysis 32 (1974) 429.Google Scholar
  55. [55]
    G. V. Vitvitskaya and V. S. Daniel'-Bek,Sov. Electrochem. 3 (1967) 863.Google Scholar
  56. [56]
    M. C. R. Symons,Int. J. Radiation Phys. Chem. 8 (1976) 381.Google Scholar
  57. [57]
    J. R. Morton,Molec. Phys. 5 (1962) 217.Google Scholar
  58. [58]
    K. N. Mochalov, V. S. Khain and G. G. Gilmanshin,Proc. Acad. Sci., USSR 162 (1965) 402.Google Scholar
  59. [59]
    G. A. Sadakov, A. Ya. Ezikyan and F. I. Kukoz,Sov. Electrochem. 13 (1977) 1540.Google Scholar
  60. [60]
    J. A. Harrison and Z. A. Khan,J. Electroanal. Chem. 26 (1970) 1.Google Scholar
  61. [61]
    S. Sibille, J. Moiroux and J. C. Marot,ibid 88 (1978) 105.Google Scholar
  62. [62]
    G. Prabhakara Rao, M. Usman and S. K. Rangarajan,Electrochim. Acta 22 (1977) 137.Google Scholar
  63. [63]
    F. L. Shippey and F. M. Donahue,Plating 60 (1973) 43.Google Scholar
  64. [64]
    A. F. Schmeckenbecher,ibid 58 (1971) 905.Google Scholar
  65. [65]
    J. E. A. M. van den Meerakker, unpublished results.Google Scholar
  66. [66]
    E. A. Efimov, T. V. Gerish and I. G. Erusalimchik,Prot. Metals 12 (1976) 631.Google Scholar
  67. [67]
    H. Niederprüm and H. G. Klein,Metalloberfläche 24 (1970) 468.Google Scholar
  68. [68]
    G. O. Mallory and T. R. Horhn,Plating 66 (1979) 40.Google Scholar
  69. [69]
    R. N. Rhoda,J. Electrochem. Soc. 108 (1961) 707Google Scholar

Copyright information

© Chapman and Hall Ltd 1981

Authors and Affiliations

  • J. E. A. M. Van Den Meerakker
    • 1
  1. 1.Philips Research LaboratoriesEindhovenThe Netherlands

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