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Journal of Applied Electrochemistry

, Volume 12, Issue 4, pp 449–461 | Cite as

Current-time behaviour for copper electrodeposition. II. Experimental examination of surface diffusion and direct incorporation models at hemispherical sites

  • Y. Ogata
  • K. Yamakawa
  • S. Yoshizawa
Papers

Abstract

The surface diffusion model has been examined by the measurement of current-time transients for copper electrodeposition on to a polycrystalline copper electrode in acidic copper sulphate solution. The results did not satisfy the surface diffusion model criteria. The current-time profiles showed a linear dependence on 1/t1/2 except at high overpotentials. This behaviour could be explained by a direct incorporation model at hemispherical sites through a hemispherical diffusion layer. A parameter characterizing this model, the number of sites, was estimated to be of the order of 104 cm−2.

Keywords

Diffusion Layer Copper Electrode Sulphate Solution Copper Sulphate Model Criterion 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall Ltd. 1982

Authors and Affiliations

  • Y. Ogata
    • 1
  • K. Yamakawa
    • 1
  • S. Yoshizawa
    • 1
  1. 1.Department of Industrial ChemistryKyoto UniversityKyotoJapan

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