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Current-time behaviour for copper electrodeposition. II. Experimental examination of surface diffusion and direct incorporation models at hemispherical sites

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Abstract

The surface diffusion model has been examined by the measurement of current-time transients for copper electrodeposition on to a polycrystalline copper electrode in acidic copper sulphate solution. The results did not satisfy the surface diffusion model criteria. The current-time profiles showed a linear dependence on 1/t 1/2 except at high overpotentials. This behaviour could be explained by a direct incorporation model at hemispherical sites through a hemispherical diffusion layer. A parameter characterizing this model, the number of sites, was estimated to be of the order of 104 cm−2.

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Author notes

  1. Y. Ogata

    Present address: Department of Synthetic Chemistry, Nagoya Institute of Technology, Gokiso-cho, Showa-Ku, 466, Nagoya, Japan

Authors and Affiliations

  1. Department of Industrial Chemistry, Kyoto University, Kyoto, Japan

    Y. Ogata, K. Yamakawa & S. Yoshizawa

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  1. Y. Ogata
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  2. K. Yamakawa
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  3. S. Yoshizawa
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Ogata, Y., Yamakawa, K. & Yoshizawa, S. Current-time behaviour for copper electrodeposition. II. Experimental examination of surface diffusion and direct incorporation models at hemispherical sites. J Appl Electrochem 12, 449–461 (1982). https://doi.org/10.1007/BF00610487

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  • DOI: https://doi.org/10.1007/BF00610487

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