Journal of Applied Electrochemistry

, Volume 12, Issue 4, pp 449–461 | Cite as

Current-time behaviour for copper electrodeposition. II. Experimental examination of surface diffusion and direct incorporation models at hemispherical sites

  • Y. Ogata
  • K. Yamakawa
  • S. Yoshizawa


The surface diffusion model has been examined by the measurement of current-time transients for copper electrodeposition on to a polycrystalline copper electrode in acidic copper sulphate solution. The results did not satisfy the surface diffusion model criteria. The current-time profiles showed a linear dependence on 1/t1/2 except at high overpotentials. This behaviour could be explained by a direct incorporation model at hemispherical sites through a hemispherical diffusion layer. A parameter characterizing this model, the number of sites, was estimated to be of the order of 104 cm−2.


Diffusion Layer Copper Electrode Sulphate Solution Copper Sulphate Model Criterion 
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Copyright information

© Chapman and Hall Ltd. 1982

Authors and Affiliations

  • Y. Ogata
    • 1
  • K. Yamakawa
    • 1
  • S. Yoshizawa
    • 1
  1. 1.Department of Industrial ChemistryKyoto UniversityKyotoJapan

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