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Journal of Applied Electrochemistry

, Volume 12, Issue 4, pp 439–447 | Cite as

Current-time behaviour for copper electrodeposition. I. Theoretical analysis based on a surface diffusion model

  • Y. Ogata
  • K. Yamakawa
  • S. Yoshizawa
Papers

Abstract

The form of the current-time transients for copper electrodeposition from copper sulphate solutions have been calculated based on a surface diffusion model. The transient was greatly affected by whether the ad-species diffusing across the surface was ad-atom Cu0 or ad-ion Cu+, and by the surface coverage by the ad-species. The results imply that it is possible to experimentally test the applicability of the surface diffusion model to copper electrodeposition, to identify the ad-species (Cu0 or Cu+), to estimate the surface coverage and to calculate the parameters related to surface diffusion,D/l2 andi0/c0.

Keywords

Copper Sulphate Physical Chemistry Theoretical Analysis Diffusion Model 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall Ltd. 1982

Authors and Affiliations

  • Y. Ogata
    • 1
  • K. Yamakawa
    • 1
  • S. Yoshizawa
    • 1
  1. 1.Department of Industrial ChemistryKyoto UniversityKyotoJapan

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