Journal of Applied Electrochemistry

, Volume 12, Issue 4, pp 439–447 | Cite as

Current-time behaviour for copper electrodeposition. I. Theoretical analysis based on a surface diffusion model

  • Y. Ogata
  • K. Yamakawa
  • S. Yoshizawa


The form of the current-time transients for copper electrodeposition from copper sulphate solutions have been calculated based on a surface diffusion model. The transient was greatly affected by whether the ad-species diffusing across the surface was ad-atom Cu0 or ad-ion Cu+, and by the surface coverage by the ad-species. The results imply that it is possible to experimentally test the applicability of the surface diffusion model to copper electrodeposition, to identify the ad-species (Cu0 or Cu+), to estimate the surface coverage and to calculate the parameters related to surface diffusion,D/l2 andi0/c0.


Copper Sulphate Physical Chemistry Theoretical Analysis Diffusion Model 
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Copyright information

© Chapman and Hall Ltd. 1982

Authors and Affiliations

  • Y. Ogata
    • 1
  • K. Yamakawa
    • 1
  • S. Yoshizawa
    • 1
  1. 1.Department of Industrial ChemistryKyoto UniversityKyotoJapan

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