Journal of Nondestructive Evaluation

, Volume 3, Issue 2, pp 111–113 | Cite as

Photothermal examination of an adhesive layer

  • R. Tilgner
  • J. Baumann


An adhesive layer, by which a piezoceramic foil is attached to an aluminum membrane for telephone application, is examined in a nondestructive way by thermal waves. The basic principles of the method are outlined, and its detecting power is demonstrated by evaluation of a well-defined delamination.

Key words

photoacoustic microscopy delamination layered structure NDE 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    A. Rosencwaig,Adv. Electronics Electron Phys. 46:207 (1978).Google Scholar
  2. 2.
    M. J. Adams and G. F. Kirkbright,Spectrosc. Lett. 9(5):255 (1976).Google Scholar
  3. 3.
    R. Florian, H. Pelzl, M. Rosenberg, H. Vargas, and R. Wernhardt,Phys. Stat. Sol. (A)48:K35 (1978).Google Scholar
  4. 4.
    J. F. McClelland and R. N. Kniseley,Bull. Am. Phys. Soc. 24:315 (1979).Google Scholar
  5. 5.
    C. Pichon, M. Le Liboux, D. Fournier, and A. C. Boccara,Appl. Phys. Lett. 35:435 (1979).Google Scholar
  6. 6.
    P. Korpiun, J. Baumann, E. Lüscher, E. Papamokos, and R. Tilgner,Phys. Stat. Sol. (A)58:K13 (1980).Google Scholar
  7. 7.
    P. S. Bechthold, M. Campagna, and T. Schober,Solid State Commun. 36:225 (1980).Google Scholar
  8. 8.
    W. Knoll, J. Baumann, P. Korpiun, and U. Theilen,Biochem. Biophys. Res. Commun. 96:968 (1980).Google Scholar
  9. 9.
    P. Korpiun and R. Tilgner,J. Appl. Phys. 51:6115 (1980).Google Scholar
  10. 10.
    D. Cahen,Appl. Phys. Lett. 33(9):810 (1978).Google Scholar
  11. 11.
    S. Malkin and D. Cahen,Photochem. Photobiol. 29:803 (1979).Google Scholar
  12. 12.
    P.-E. Nordal and S. O. Kanstad,Phys. Scripta 20:659 (1979).Google Scholar
  13. 13.
    G. Busse,Optics Commun. 36(6):441 (1981).Google Scholar
  14. 14.
    A. Hordvik and H. Schlossberg,Appl. Opt. 16(1):101 (1977).Google Scholar
  15. 15.
    M. M. Farrow, R. K. Burnham, M. Anzanneau, S. L. Olsen, N. Purdie, and E. M. Eyring,Appl. Opt. 17(7):1093 (1978).Google Scholar
  16. 16.
    W. Jackson and N. M. Amer,J. Appl. Phys. 51(6):3343 (1980).Google Scholar
  17. 17.
    G. Busse and A. Rosencwaig,Appl. Phys. Lett. 36(10):815 (1980).Google Scholar
  18. 18.
    J. F. McClelland and R. N. Kniseley,Appl. Opt. 15:2658 (1976).Google Scholar
  19. 19.
    J. C. Murphy and L. C. Aamodt,J. Appl. Phys. 48:3502 (1977).Google Scholar
  20. 20.
    D. Cahen, E. I. Lerner, and A. Auerbach,Rev. Sci. Instrum. 49(8):1206 (1978).Google Scholar
  21. 21.
    D. Cahen,Rev. Sci. Instrum. 52(9):1306 (1981).Google Scholar
  22. 22.
    Y. H. Wong, R. L. Thomas, and G. F. Hawkins,Appl. Phys. Lett. 32(9):538 (1978).Google Scholar
  23. 23.
    R. L. Thomas, J. J. Pouch, Y. H. Wong, L. D. Favro, P. K. Kuo, A. Rosencwaig,J. Appl. Phys. 51(2):1152 (1980).Google Scholar
  24. 24.
    A. Rosencwaig and G. Busse,Appl. Phys. Lett. 36(9):725 (1980).Google Scholar
  25. 25.
    K. Walliser,Frequenz 30:272 (1976).Google Scholar
  26. 26.
    J.-P. Monchalin, J.-L. Parpal, L. Bertrand, and J.-M. Gagne,Appl. Phys. Lett. 39(5):391 (1981).Google Scholar

Copyright information

© Plenum Publishing Corporation 1982

Authors and Affiliations

  • R. Tilgner
    • 1
  • J. Baumann
    • 1
  1. 1.Siemens AG, Zentrale FertigungsaufgabenMunichW. Germany

Personalised recommendations