Abstract
A maximum in mixed-mode adhesive fracture energy has been observed at bond angles of 45° using scarf-joint test specimens. It is shown here that by reducing the adherend surface roughness from 1.2μm CLA roughness (milled surfaces) to 0.08μm CLA roughness (polished surfaces) the fracture energy becomes a linear function of bond angle (no maximum at 45°) and there is an overall crease in fracture energy at all bond angles. These results are discussed in terms of crack initiation being “focused” into the interfacial region and a pinning of crack-tip shear displacements by the surface roughness of the milled adherends which does not occur for the polished adherends.
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Bascom, W.D., Oroshnik, J. Effect of bond angle on mixed-mode adhesive fracture. J Mater Sci 13, 1411–1418 (1978). https://doi.org/10.1007/BF00553193
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DOI: https://doi.org/10.1007/BF00553193