Journal of Materials Science

, Volume 11, Issue 6, pp 1083–1090 | Cite as

The solid phase bonding of copper, nickel and some of their alloys to diamonds

  • B. Dewar
  • M. Nicholas
  • P. M. Scott
Papers

Abstract

The bonding achieved by vacuum hot-pressing cylinders of copper, nickel and a few of their alloys against diamond plaques has been measured. Alloying with carbide-forming elements such as titanium can have a markedly beneficial effect on the bonding of copper and, to a lesser extent, of nickel. The strengths obtained also depended on the fabrication time and temperature, at first increasing and then decreasing with time. These phenomena are compared to those observed previously in a study of bonding between diamonds and molten copper alloys. Some evidence is presented that relates the phenomena to the abrasiveness of diamond grit compacts.

Keywords

Polymer Copper Titanium Nickel Beneficial Effect 

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Copyright information

© Chapman and Hall Ltd. 1976

Authors and Affiliations

  • B. Dewar
    • 1
  • M. Nicholas
    • 2
  • P. M. Scott
    • 2
  1. 1.De Beers Industrial Diamond DivisionJohannesburgSouth Africa
  2. 2.High Temperature Chemical Technology Project, Materials Development DivisionAEREHarwellUK

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