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Journal of Materials Science

, Volume 5, Issue 5, pp 374–378 | Cite as

Inhibition of diffusion creep in copper by dissolved oxygen

  • E. D. Hondros
  • C. R. Lake
Papers

Abstract

It is proposed that under certain conditions, diffusion creep may be interface-controlled. Evidence is presented for copper with oxygen in solid solution, in which conditions oxygen chemisorbs at interfaces, and reduces their effectiveness as sources and sinks for vacancies, thereby slowing down diffusion creep. In addition, in conditions where the surface oxide is stable, inhibition of diffusion creep is even more pronounced.

Keywords

Oxide Oxygen Polymer Copper Solid Solution 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall Ltd. 1970

Authors and Affiliations

  • E. D. Hondros
    • 1
  • C. R. Lake
    • 1
  1. 1.Division of Inorganic and Metallic StructureNational Physical LaboratoryTeddingtonUK

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