Inhibition of diffusion creep in copper by dissolved oxygen
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It is proposed that under certain conditions, diffusion creep may be interface-controlled. Evidence is presented for copper with oxygen in solid solution, in which conditions oxygen chemisorbs at interfaces, and reduces their effectiveness as sources and sinks for vacancies, thereby slowing down diffusion creep. In addition, in conditions where the surface oxide is stable, inhibition of diffusion creep is even more pronounced.
KeywordsOxide Oxygen Polymer Copper Solid Solution
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