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Percent of low molecular compounds in the fibre as a factor in the adhesion properties of cord 23K

  • The 10th Five-Year Plan — A Five-Year Plan For Product Quality And Production Efficiency
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Literature cited

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Translated from Khimicheskie Volokna, No.2, pp. 42–43, March–April, 1976.

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Gerbich, A.Y., Uzina, R.V. & Ionova, T.V. Percent of low molecular compounds in the fibre as a factor in the adhesion properties of cord 23K. Fibre Chem 8, 178–179 (1976). https://doi.org/10.1007/BF00547698

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  • DOI: https://doi.org/10.1007/BF00547698

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