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Study of the cure kinetics of structural adhesives by ultrasonic interface waves

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Abstract

An ultrasonic method for in situ study of the curing kinetics of structural adhesives is described. The measurements are performed by ultrasonic interface waves, which produce shear oscillations in the plane of the bond line. The shear resistance of the interface changes in the curing process: softening of the prepreg and its transition to the liquid phase, and the beginning and the termination of the polymerization reaction. Measurements performed at temperatures from 60 to 120° C for the FM-73 adhesive showed that the activation energy of the curing reaction is 38.9 kJ mol−1.

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Authors and Affiliations

  1. Department of Materials Engineering, Ben-Gurion University of the Negev, PO Box 653, 84105, Beer-Sheva, Israel

    S. I. Rokhlin

  2. Ha Galil 45, 32 686, Haifa, Israel

    E. Segal

Authors
  1. S. I. Rokhlin
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  2. E. Segal
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Additional information

On sabbatical leave at the Department of Welding Engineering, Ohio State University, 190 W, 19th Avenue, Columbus, Ohio 43210-1182, USA.

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Rokhlin, S.I., Segal, E. Study of the cure kinetics of structural adhesives by ultrasonic interface waves. J Mater Sci 20, 3300–3304 (1985). https://doi.org/10.1007/BF00545198

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  • DOI: https://doi.org/10.1007/BF00545198

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