Abstract
The influence of temperature and applied stress on creep in single crystals of lead has been investigated. Between 20 and 180 K a thermally activated “logarithmic” creep is observed that is easily interpreted in terms of theory based on a work hardening concept. In case recovery processes are absent the weakening of the “logarithmic” creep is determined by hardening of the crystal during the creep process and the level of effective stresses. The creep vanishes when the effective stresses become zero. The disappearance of creep at the point T 0 has been shown experimentally. The temperature T 0 is that at which critical shear stresses reach the temperature-independent branch of the yield-point curve Τ T (T). At temperatures higher than T 0 a steady-state creep is observed. At a fixed stress the creep rate is determined by the rate of recovery processes. The results obtained are described in terms of thermally activated dislocation motion.
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Startsev, V.I., Osetski, A.I., Soldatov, V.P. et al. Temperature and stress dependences of creep in single crystals of lead between 20 and 300 K. J Mater Sci 10, 387–392 (1975). https://doi.org/10.1007/BF00543681
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DOI: https://doi.org/10.1007/BF00543681