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Formation of submicrocrystalline structure in TiAl intermetallic compound

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Abstract

The TiAl intermetallic compound was used to illustrate an approach which enables the creation of a submicrocrystalline structure (d≃0.1 μm) in massive semifinished products made of hard-to-deform materials by means of their deformation at elevated temperatures. Tensile mechanical properties of the TiAl intermetallic compound with a mean grain size of 0.4 μm were tested. In this state, the lower temperature limit of superplasticity in TiAl was found to be 800°C. At this temperature and at an initial strain rate of 8.3×10−4s−1, the relative elongation to rupture attains 225%.

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Imayev, R.M., Imayev, V.M. & Salishchev, G.A. Formation of submicrocrystalline structure in TiAl intermetallic compound. J Mater Sci 27, 4465–4471 (1992). https://doi.org/10.1007/BF00541580

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