International Journal of Thermophysics

, Volume 10, Issue 5, pp 1075–1084 | Cite as

Thermal conductivity, heat capacity, and thermal diffusivity of selected commercial AlN substrates

  • R. B. Dinwiddie
  • A. J. Whittaker
  • D. G. Onn


The thermal transport properties of four commercially available AlN substrates have been investigated using a combination of steady-state and transient techniques. Measurements of thermal conductivity using a guarded longitudinal heat flow apparatus are in good agreement with published room temperature data (in the range 130–170 W · m−1 · K−1). Laser flash diffusivity measurements combined with heat capacity data yielded anomalously low results. This was determined to be an experimental effect for which a method of correction is presented. Low-temperature measurements of thermal conductivity and heat capacity are used to probe the mechanisms that limit the thermal conductivity in AlN.

Key words

aluminum nitride heat capacity substrate thermal conductivity thermal diffusivity 


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Copyright information

© Plenum Publishing Corporation 1989

Authors and Affiliations

  • R. B. Dinwiddie
    • 1
  • A. J. Whittaker
    • 1
  • D. G. Onn
    • 1
  1. 1.Department of Physics and AstronomyUniversity of DelawareNewarkUSA

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