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Copper thin films prepared by chemical vapour deposition from copper dipivalylmethanate

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Abstract

Copper thin films were prepared by a low-temperature atmospheric-pressure chemical vapour deposition method. The raw material was copper dipivalylmethanate which is volatile and thermally stable. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was in the range 1.7–2.7 μΩ cm.

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References

  1. D. PETERSON, “Non-Vacuum deposition Techniques for Use in Fabricating Thin Film Circuits”, No. NObsr 91336, Final Report (1967).

  2. G. D. KUZNETOZO, A. A. BABED-ZAKHRYAPIN and V. F. GVOZD, Protection Metals 8 (1972) 565.

    Google Scholar 

  3. P. POWLYK, US Pat. 2704728 (1955).

  4. F. E. DRUMMOND, US Pat. 2881 514 (1978).

  5. C. F. POWELL, J. H. OXLEY, and J. M. BLOCHER Jr (eds), “Vapor Deposition” (Wiley, New York, 1966) p. 277.

    Google Scholar 

  6. R. L. VAN HEMERT, L. B. SPENDLOVE and R. E. SIEVERS, J. Electrochem. Soc. 112 (1965) 1123.

    Article  CAS  Google Scholar 

  7. N. AWAYA and Y. ARITA, in “Proceedings of the Symposium on VLSI Technology”, Kyoto 1989 (IEEE, Japan Society of Applied Physics, 1989) p. 103.

  8. D. TEMPLE and A. REISMAN, J. Electrochem. Soc. 136 (1989) 3525.

    Article  CAS  Google Scholar 

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Maruyama, T., Ikuta, Y. Copper thin films prepared by chemical vapour deposition from copper dipivalylmethanate. JOURNAL OF MATERIALS SCIENCE 28, 5540–5542 (1993). https://doi.org/10.1007/BF00367827

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